Laser Marking and Wafer Sorting – 2“ to 200 mm

InnoLas Semiconductor develops and manufactures highly efficient processing systems for laser marking, sorting and the inspection of wafers for the semiconductor industry.

All marking and sorting processes meet the common industrial standards (SEMI, ...) for the production of semiconductor wafers. State of the art laser quality, sophisticated automation, precise handling systems and advanced application software offer greater productivity and overall system reliability.

For wafer sizes from 2“ to 200 mm, InnoLas Semiconductor offers the IL 2000 series for wafer marking processes and the IL 2600 series as multi functional tools for wafer sorting, wafer merging/splitting and wafer inspection.